Жидкий термоинтерфейс с фазовым переходом от Laird: (документ в аттаче)
TpcmTM 780SP
High Performance TIM
THR-DS-TPCM 780SP 08102022
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird
Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any
kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2020 Laird Technologies, Inc. All Rights Reserved. Laird, Laird
Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license
under any Laird Technologies or any third party intellectual property rights.
*De-notes after solvent evaporation. Solvent evaporates within two hours at 60˚C, or 8 hours at room temperature.
After solvent evaporation the Tpcm 780SP will be firm and dry to the touch
PRODUCT DESCRIPTION
Tpcm™ 780SP is a high performance, easy to use, screen printable or stencilable phase
change thermal interface material proving a great alternative to grease. Developed
specifically to meet the high thermal conductivity and low thermal resistance requirements
of today’s demanding processors. It contains a solvent to assist in processing, which
allows for wetting of the surface. However, after the solvent evaporates, it will be dry to the
touch; therefore, eliminating the mess associated with grease.
Tpcm™ 780SP is a silicone-free material that begins to further soften and flow at
approximately 45ºC. This minimizes contact thermal resistance by filling the microscopic
irregularities of the components it contacts. Designed with a specialty polymeric matrix
which does not fully change phase, Tpcm™ 780SP drastically minimizes migration (pump
out) over thermal greases and other phase change materials. Tpcm™ 780SP reliability
has been demonstrated though exposure to 2000 hours of various aging tests resulting in
proven dependability at an operating temperature of 125°C.
FEATURES & BENEFITS
• Silicone-free for applications that are silicone
sensitive
• No mess due to thixotropic characteristics which
prevent flow outside of interface
• Very soft at room temperature, therefore less
stress on board
• RoHS Compliant
• 94V0 UL Flammability Rating
MARKETS
• Graphics Card
• Notebooks / Desktops
• Servers
• IGBTs
• Automotive
• Memory Modules
• Game Consoles
AVAILABILITY
• 0.5 kg or 1.0 kg can for easy manual screen
printing and large volume automatic applications
STORAGE CONDITIONS
• Store from 15˚
Термоинтерфейсы
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Термоинтерфейсы
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